TSMC to double CoWoS packaging capacity by 2027
TSMC announced plans to double its CoWoS advanced packaging capacity due to strong AI accelerator demand, expected to remain sold out through 2027.
Summary
TSMC announced plans to double its CoWoS advanced packaging capacity due to strong AI accelerator demand, expected to remain sold out through 2027.
- Announced plan to double CoWoS packaging capacity by 2027
- Cited strong AI accelerator demand keeping capacity sold out through 2027
- #tsmc
- #cowos
- #chip packaging
- #ai accelerators
- #capacity expansion