TSMC to double CoWoS packaging capacity by 2027
TSMC announced plans to double its CoWoS advanced packaging capacity due to strong AI accelerator demand, expected to remain sold out through 2027.
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Summary
TSMC announced plans to double its CoWoS advanced packaging capacity due to strong AI accelerator demand, expected to remain sold out through 2027.
- Announced plan to double CoWoS packaging capacity by 2027
- Cited strong AI accelerator demand keeping capacity sold out through 2027
Discussion4
MK Marta KowalskaMortgage analyst14 min ago The borrower savings figure is the real headline here. Variable-rate households will feel this within two billing cycles.
DO Daniel Ortega9 min ago Only if banks pass it through quickly. Last cycle the lag was closer to four months.
MK Marta KowalskaMortgage analyst6 min ago Fair point — competition is tighter this time, so I expect a faster pass-through.
LF Lena Fischer22 min ago Would love a follow-up on how this interacts with the złoty. The rate gap story feels underpriced.
